Method of forming a conductive via plug

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material

Reexamination Certificate

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Details

C438S098000, C438S453000, C438S584000, C438S597000, C438S669000, C438S689000, C438S695000, C216S017000, C216S018000

Reexamination Certificate

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07358184

ABSTRACT:
A method of forming a conductive via plug is disclosed. The conductive via plug is formed by printing a solution comprising a solvent with insulating material dissolve capability and a conductive material by an inkjet method. The formed conductive via plug has a low resistivity and thus may serve as an electrical connection between two separate conductive layers. This manufacturing method of the conductive via plug may achieve simultaneously deposition, patterning and etching purposes, which significantly simplifies the manufacturing process.

REFERENCES:
patent: 5976393 (1999-11-01), Abe
patent: 6270389 (2001-08-01), Kobayashi et al.
patent: 2003/0059987 (2003-03-01), Sirringhaus et al.
patent: 2003/0107044 (2003-06-01), Kubota et al.

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