Method of forming a conductive metal pattern

Coating processes – Electrical product produced – Integrated circuit – printed circuit – or circuit board

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427123, 427125, 427216, 427220, 427229, 427256, 427282, 427287, 4273766, 4273767, 4273831, 4273835, H05K 300

Patent

active

043339662

ABSTRACT:
A novel silver powder composition characterized by a very low fusion, or film-forming temperature, probably assignable to the relatively small amount of oxides or other undesirable occlusions within coatings formed of the powder. The invention also relates to a new process for forming such a powder; the process is believed to involve the formation of a fatty-acid silver reaction product of the surface of the silver powder before it is subjected to fusion into a metallic coating. During fusion the decomposing reactant seems to act as a flux aiding the formation of a metal film of superior appearance and strength.

REFERENCES:
patent: 3345199 (1967-10-01), Fitch
patent: 3383247 (1968-05-01), Adlhart et al.
patent: 3528845 (1970-09-01), Donley
patent: 3694254 (1972-09-01), Blumenthal
patent: 3814696 (1974-06-01), Verdone et al.
patent: 3843349 (1974-10-01), Ehrreich et al.

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