Method of forming a conductive line

Details Method of forming a conductive line Method of forming a conductive line

2006-08-22

2006-08-22

Fourson, George (Department: 2823)

Semiconductor device manufacturing: process

Making field effect device having pair of active regions...

Having schottky gate

C438S230000, C438S286000, C438S366000, C438S445000, C438S595000, C257S900000, C257SE21626, C257SE21640

Reexamination Certificate

active

07094636

ABSTRACT:
A method of forming a conductive line includes forming conductive material received over a semiconductor substrate into a line having opposing sidewalls. Insulative material is deposited over the line, and is planarized. An insulating spacer forming layer is deposited over the line and the planarized insulative material. The spacer forming layer is anisotropically etched form a pair of insulative spacers over the opposing line sidewalls with the insulative material being received between at least one of the sidewalls and one insulative spacer formed thereover. The insulative material as so received has a maximum lateral thickness which is greater than a maximum lateral thickness of the one sidewall spacer.

REFERENCES:
patent: 4546537 (1985-10-01), Kawabe et al.
patent: 5081060 (1992-01-01), Kim
patent: 5126279 (1992-06-01), Roberts
patent: 5135882 (1992-08-01), Karniewicz
patent: 5346585 (1994-09-01), Doan et al.
patent: 5356834 (1994-10-01), Sugimoto et al.
patent: 5413961 (1995-05-01), Kim
patent: 5494841 (1996-02-01), Dennison et al.
patent: 5589415 (1996-12-01), Blanchard
patent: 5656520 (1997-08-01), Watanabe
patent: 5717242 (1998-02-01), Michael et al.
patent: 5733809 (1998-03-01), Dennison et al.
patent: 5734179 (1998-03-01), Chang et al.
patent: 5741735 (1998-04-01), Violette et al.
patent: 5789316 (1998-08-01), Lu
patent: 5801082 (1998-09-01), Tseng
patent: 5883010 (1999-03-01), Merrill et al.
patent: 5898006 (1999-04-01), Kudoh
patent: 5899721 (1999-05-01), Gardner et al.
patent: 6033969 (2000-03-01), Yoo et al.
patent: 6051462 (2000-04-01), Ohno
patent: 6077763 (2000-06-01), Chen et al.
patent: 6097052 (2000-08-01), Tanaka et al.
patent: 6163059 (2000-12-01), Hause et al.
patent: 6177318 (2001-01-01), Ogura et al.
patent: 6180494 (2001-01-01), Manning
patent: 6225675 (2001-05-01), Manning
patent: 6249015 (2001-06-01), Matsuo et al.
patent: 6255215 (2001-07-01), Hause et al.
patent: 11054724 (1997-08-01), None
patent: 59-133944 (1984-09-01), None
patent: 3-161937 (1991-07-01), None
patent: 3-276727 (1991-12-01), None
patent: 5-198684 (1993-08-01), None
patent: 411566 (2000-11-01), None

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