Method of forming a component having dielectric sub-layers

Details Method of forming a component having dielectric sub-layers Method of forming a component having dielectric sub-layers

2007-09-04

2007-09-04

Smith, Zandra V. (Department: 2822)

Semiconductor device manufacturing: process

Coating of substrate containing semiconductor region or of...

Insulative material deposited upon semiconductive substrate

C438S082000, C438S780000

Reexamination Certificate

active

10971337

ABSTRACT:
Embodiments of methods, apparatuses, devices, and/or systems for forming a component having dielectric sub-layers are described.

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International Search Report and Written Opinion of the International Searching Authority dated Aug. 2, 2006.

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