Method of forming a coated plastic package

Details Method of forming a coated plastic package Method of forming a coated plastic package

1991-10-04

1994-04-12

Hearn, Brian E.

Fishing, trapping, and vermin destroying

437211, 437214, 437215, 437219, 174 522, 174 523, 427421, 427427, H01L 2160

Patent

active

053025539

ABSTRACT:
The invention is to a semiconductor package and the method of making the package. A moisture resistant coating such as a ceramic, silica or other plastic material is applied over a plastic packaged semiconductor device to seal the package from moisture.

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