Method of forming a ceramic circuit substrate

Metal working – Method of mechanical manufacture – Electrical device making

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291484B, 100295, 264 22, 264 61, 264241, 264259, 264263, 264319, 264511, H05K 300, H05K 336

Patent

active

043465161

ABSTRACT:
A method of forming a ceramic circuit substrate allowing mounting of high integration density semiconductor elements. The method provides a multilayered ceramic circuit substrate having via holes formed with high accuracy and high integration density wiring patterns by forming metallic conductive balls to connect the conductive wiring patterns of upper and lower layers; a ball arranging plate having many holes placing on a green sheet uniformly in close contact; filling the holes of the plate with the embedding the conductive balls by pressure into the green sheet; and thereafter baking the green sheet individually or in a stacked layered arrangement.

REFERENCES:
patent: 3075281 (1963-01-01), Spooner
patent: 3397453 (1968-08-01), Gwyn, Jr.
patent: 3808681 (1974-05-01), Law et al.
patent: 4050756 (1977-09-01), Moore
patent: 4067945 (1978-01-01), DuRocher
patent: 4109377 (1978-08-01), Blazick et al.
IBM Multichip Multilayer Ceramic Modules for LSI Chips-"Designed for Performance and Density"-IEEE Transaction, 1980, vol. CHMTS, No. 3, No. 1, Mar. 1980.

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