Method of forming a bump comprising protuberances

Details Method of forming a bump comprising protuberances Method of forming a bump comprising protuberances

1998-09-23

2000-07-04

McPherson, John A.

Radiation imagery chemistry: process, composition, or product th

Imaging affecting physical property of radiation sensitive...

Making electrical device

438613, G03F 700

Patent

active

060836660

ABSTRACT:
A bump structure with a recessed portion, as defined by a projection, which collects conductive balls suspended in an ACF when forming a bond between an IC and a liquid crystal panel using the chip-on-glass method. The bump structure improves the electrical contact between the bump and the pad, as well reduce the migration of conductive balls into open areas between aligned bumps during the bonding process.

REFERENCES:
patent: 5545589 (1996-08-01), Tomura et al.
patent: 5631499 (1997-05-01), Hosomi et al.

Affiliated with

Also associated with

Rating

Method of forming a bump comprising protuberances does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method of forming a bump comprising protuberances, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of forming a bump comprising protuberances will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1484779