Method of forming 3D micro structures with high aspect ratios

Details Method of forming 3D micro structures with high aspect ratios Method of forming 3D micro structures with high aspect ratios

2011-05-24

2011-05-24

Duda, Kathleen (Department: 1722)

Radiation imagery chemistry: process, composition, or product th

Imaging affecting physical property of radiation sensitive...

Making electrical device

C430S396000

Reexamination Certificate

active

07947430

ABSTRACT:
A method of forming 3D micro structures with high aspect ratios includes the steps of: disposing a mask, which has a plurality of through holes having at least two different sizes, on a substrate to expose the substrate through the through holes; forming a negative photoresist layer on the mask and the substrate; providing a light source to illuminate the negative photoresist layer through the substrate and the through holes of the mask so as to form a plurality of exposed portions and an unexposed portion; and removing the unexposed portion and leaving the exposed portions to form a plurality of pillars each having a bottom portion contacting the substrate and a top portion opposite to the bottom portion. A top area of the top portion is slightly smaller than a bottom area of the bottom portion, and the pillars are allowed to have at least two different heights.

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Huang, H et al., Journal of Micromechanics and Microengineering, 17 (2007) 291-296, “3D high aspect ratio micro structures fabricated by one step UV lithography”.

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