Method of fluorinated silicon oxide film deposition

Coating processes – Coating by vapor – gas – or smoke – Mixture of vapors or gases utilized

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4272557, 438624, 438763, C23C 1640

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active

058767983

ABSTRACT:
Films of fluorinated silicon oxide, suitable for use as inter-metal dielectrics, have been deposited by means of CVD at reduced pressure using fluorotriethoxysilane (FTES) and tetra-exthyloxysilane (TEOS) as the precursors, together with ozone (mixed with oxygen). If tight control over the deposition conditions is exercised, high quality films having no surface damage and good step coverage, with no trapped voids, can be obtained. In a second embodiment of the invention, the TEOS is omitted and only FTES is used. Among the most important deposition parameters we include temperature at 400-500.degree. C., pressure at 200-260 torr, ozone concentration (in oxygen) 8-12%, and an ozone:precursor ratio of 3-10 to 1 weight percent. In a third embodiment, a stacked layer is formed, consisting of at least one fluorinated silicon oxide layer and one silicon dioxide layer, deposited within the same deposition process by changing the TEOS or the FTES flow.

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Fukuda et al, "Highly reliable SiOF Film Formation using high Density Plasma Containing Hydrogen" Proceedings of the 1997 DUMIC Conf. Feb. 10-11, pp. 41-48.
Laxman et al, "Remote Microwave Plasma Enhanced CVD of fluorine doped silicon dioxide from FASI-4 and FTES", Proceedings of the 1997 DUMIC Conference Feb. 10-11 pp. 57-63.
Homma, "Characteristics of SiOF films formed using TEOS and FTES at room temp by CVD" in J. Electrochem. Soc. vol. 143, pp. 707-711 (Feb. 1996).
Kubo et al, "An SiO.sub.2 film Depositon technology using tetraethylorthosilicate and ozone for interlayer metal dielectrics" J. Electrochem Soc. vol. 143, pp. 1769-1773 May, 1996.
Fujino et al, "Silicon Dioxide Deposition by Atmospheric Pressure and Low temperature CVD using TEOS and ozone" J. Electrochem Soc. vol. 137 pp. 2883-2887 Sep., 1990.

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