Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor
Reexamination Certificate
2005-04-28
2008-11-18
Koch, III, George R (Department: 1791)
Adhesive bonding and miscellaneous chemical manufacture
Methods
Surface bonding and/or assembly therefor
C156S257000, C156S297000
Reexamination Certificate
active
07452438
ABSTRACT:
A needle fixture of a probe card and a needle fixing method in semiconductor inspection equipment include a needle fixture of a probe card in semiconductor inspection equipment including a printed circuit board; a needle fixture installed in the printed circuit board; a resin unit affixing a probe needle to the needle fixture using an adhesive; and a separation preventer for preventing separation of the resin unit from the needle fixture, wherein the separation preventer includes: a plurality of notches formed along a bottom surface of the needle fixture; and the adhesive filling the plurality of notches.
REFERENCES:
patent: 4599559 (1986-07-01), Evans
patent: 4965865 (1990-10-01), Trenary
patent: 5670889 (1997-09-01), Okubo et al.
patent: 5884395 (1999-03-01), Dabrowiecki et al.
patent: 5926028 (1999-07-01), Mochizuki
patent: 6624649 (2003-09-01), Yamazaki
patent: 2-216466 (1990-08-01), None
patent: 7-098330 (1995-04-01), None
patent: 09-068545 (1997-03-01), None
patent: 10-038925 (1998-02-01), None
patent: 9-304436 (1999-07-01), None
Choi Ji-Man
Shin In-Dae
Yu Hyun-Sik
Koch, III George R
Lee & Morse P.C.
Samsung Electronics Co,. Ltd.
LandOfFree
Method of fixing a probe needle to a needle fixture of a... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Method of fixing a probe needle to a needle fixture of a..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of fixing a probe needle to a needle fixture of a... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-4042721