Method of fabrication of planar bubble domain device structures

Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step

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156656, 1566591, 1566611, 427 96, 427125, 427130, 427131, 427132, B44C 122, C03C 1500, C03C 2506

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043177000

ABSTRACT:
A method of fabricating a bubble domain device composite structure on a substrate of depositing a barrier layer of a suitable polymeric dielectric material on the substrate; subsequently depositing a layer of electrically conductive material thereover; subsequently depositing a spacer layer of a liquid polymeric dielectric material over the conductive layer; processing the spacer layer so that the surface of the spacer layer is substantially planar; and subsequently depositing a layer of a magnetically operative material over the spacer layer.

REFERENCES:
patent: 4170471 (1979-10-01), Bailey et al.
patent: 4172758 (1979-10-01), Bailey et al.

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