Method of fabrication of bubble domain device structures

Details Method of fabrication of bubble domain device structures Method of fabrication of bubble domain device structures

1980-06-06

1982-11-09

Powell, William A.

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

156656, 1566591, 357 27, 365 32, 427131, B44C 122, C03C 1500, C03C 2506, C23F 102

Patent

active

043583393

ABSTRACT:
A method of fabricating a microelectronic circuit device on a substrate by forming a layer of electrically and thermally conductive material (13) on a surface of a substrate (10). Channels are then etched in the layer of conductive material (13) to form patterns of the conductive material which are delineated from the remainder of the layer of conductive material.
The channels are filled with an electrically insulating material (21, 22, 23) so as to form a substantially planar surface layer on the substrate. Finally, a microelectronic circuit device (e.g., 25) is formed on the substantially planar surface.

REFERENCES:
patent: 4146440 (1979-03-01), Thompson
patent: 4172758 (1979-10-01), Bailey et al.
patent: 4178635 (1979-12-01), Rose
patent: 4187553 (1980-02-01), Ahn et al.
IBM Technical Disclosure Bulletin, vol. 20, No. 1, Jun. 1977, Single-Level Metallurgy Process for Fabrication of Bubble Overlays by L. T. Romankiw, pp. 394-395.

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