Single-crystal – oriented-crystal – and epitaxy growth processes; – Forming from vapor or gaseous state – With decomposition of a precursor
Reexamination Certificate
2007-06-19
2007-06-19
Kunemund, Robert (Department: 1722)
Single-crystal, oriented-crystal, and epitaxy growth processes;
Forming from vapor or gaseous state
With decomposition of a precursor
C117S095000, C117S089000, C117S091000, C117S915000, C117S930000
Reexamination Certificate
active
10827437
ABSTRACT:
The present invention relates to a method of fabrication of a substrate for an epitaxial growth. A relaxed epitaxial base layer is obtained on an auxiliary substrate. The invention allows the fabrication of substrates with a more efficient epitaxial growth of a material with a desired lattice parameter on another material with a different lattice parameter. The material can be grown with a high thermodynamic and crystallographic stability. At least a part of the epitaxial base layer is transferred onto a carrier substrate, forming a base substrate, and growing the material of the epitaxial base layer is further grown on the carrier substrate.
REFERENCES:
patent: 5362682 (1994-11-01), Bozler et al.
patent: 6039803 (2000-03-01), Fitzgerald et al.
patent: 6464780 (2002-10-01), Mantl et al.
patent: 6497763 (2002-12-01), Kub et al.
patent: 6524935 (2003-02-01), Canaperi et al.
patent: 6540827 (2003-04-01), Levy et al.
patent: 6641662 (2003-11-01), Radojevic et al.
patent: 2001/0003269 (2001-06-01), Wu et al.
patent: 1 258 544 (2002-11-01), None
patent: WO 03/009366 (2003-01-01), None
L. Huang et al., XP001116664 “Electron And Hole Mobility Enhancement In Strained SOI By Wafer Bonding”, IEEE Transactions On Electron Devices, vol. 49, No. 9, pp. 1566-1567 (2002).
L. Huang et al., XP001020601, “Sige-On-Insulator Prepared By Wafer Bonding And Layer Transfer For High-Performance Field-Effect Transistor”, Applied Physics Letters, American Institute Of Physics, vol. 78, No. 9, pp. 1267-1269, (2001).
C. Maleville et al., XP-001003462, “Multiple SOI Layers By Multiple Smart-Cut Transfers”, 2000 IEEE International SOI Conference, pp. 134-135, (2000).
Akatsu Takeshi
Aulnette Cécile
Ghyselen Bruno
Kunemund Robert
S.O.I.Tec Silicon on Insulator Technologies
Winston & Strawn LLP
LandOfFree
Method of fabrication of a substrate for an epitaxial growth does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Method of fabrication of a substrate for an epitaxial growth, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of fabrication of a substrate for an epitaxial growth will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3816805