Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate
2011-08-23
2011-08-23
Dang, Phuc T (Department: 2892)
Semiconductor device manufacturing: process
Coating with electrically or thermally conductive material
To form ohmic contact to semiconductive material
C438S666000, C257S659000
Reexamination Certificate
active
08003529
ABSTRACT:
A method of forming an integrated circuit is disclosed. The method includes providing a substrate and forming on the substrate a shield structure comprising a shield member and a ground strap. The shield member comprises a non-metallic portion, and the ground strap comprises a metallic portion.
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Cheng Michael Chye Huat
Chew Kok Wai
Chu Sanford Shao-Fu
Lim Suh Fei
Dang Phuc T
Globalfoundries Singapore Pte. Ltd.
Horizon IP Pte. Ltd.
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