Method of fabricating thin film transistor

Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – On insulating substrate or layer

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C257SE51005

Reexamination Certificate

active

07378303

ABSTRACT:
A method for fabricating a thin film transistor is provided. A conductive layer is formed on a substrate. A patterned mask is formed on the conductive layer to cover a predetermined thin film transistor (TFT) area, and at least one portion of the conductive layer exposed by the patterned mask are removed. A laser is applied to form a laser hole in the patterned mask to expose a portion of the conductive layer and the laser hole substantially corresponds to a channel region of the predetermined TFT area. The exposed conductive layer is etched to form source and drain electrodes on opposite sides of the channel region.

REFERENCES:
patent: 5529951 (1996-06-01), Noguchi et al.
patent: 7135360 (2006-11-01), Chae et al.
patent: 7229862 (2007-06-01), Yamazaki et al.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Method of fabricating thin film transistor does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method of fabricating thin film transistor, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of fabricating thin film transistor will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-2797130

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.