Method of fabricating suspended structure

Details Method of fabricating suspended structure Method of fabricating suspended structure

2006-03-22

2008-08-12

Vu, David (Department: 2818)

Semiconductor device manufacturing: process

Making device or circuit responsive to nonelectrical signal

Physical stress responsive

C438S689000

Reexamination Certificate

active

07410821

ABSTRACT:
A substrate having a sacrificial layer and a structural layer disposed on the front surface of the substrate is provided. Thereon an opening is formed on the back surface of the substrate and the sacrificial layer is exposed partially. A wet etching process is performed to etch the sacrificial layer via the opening to form a suspended structure. Finally, a gas injection process is performed. The gas injection process comprises blowing a gas on the suspended structure via the opening and consequently preventing the suspended structure from sticking to the substrate.

REFERENCES:
patent: 6816301 (2004-11-01), Schiller

Affiliated with

Also associated with

Rating

Method of fabricating suspended structure does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method of fabricating suspended structure, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of fabricating suspended structure will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3998577