Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate
2005-09-22
2009-06-09
Lebentritt, Michael S (Department: 2829)
Semiconductor device manufacturing: process
Coating with electrically or thermally conductive material
To form ohmic contact to semiconductive material
C438S597000, C438S605000, C438S687000, C438S707000, C438S708000, C257SE21051, C257SE21091, C257SE21209, C257SE21226, C257SE21579, C257SE29306
Reexamination Certificate
active
07544603
ABSTRACT:
A method of fabricating a silicon nitride layer is described. First, a substrate is provided. Then, a silicon nitride layer is formed on the substrate. The silicon nitride layer is UV-cured in an atmosphere lower than the standard atmospheric pressure. Through the UV curing treatment, the tensile stress of the silicon nitride layer is increased.
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Chen Neng-Kuo
Liao Hsiu-Lien
Tsai Teng-Chun
J.C. Patents
Lebentritt Michael S
United Microelectronics Corp.
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