Method of fabricating silicon nitride layer and method of...

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material

Reexamination Certificate

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C438S597000, C438S605000, C438S687000, C438S707000, C438S708000, C257SE21051, C257SE21091, C257SE21209, C257SE21226, C257SE21579, C257SE29306

Reexamination Certificate

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07544603

ABSTRACT:
A method of fabricating a silicon nitride layer is described. First, a substrate is provided. Then, a silicon nitride layer is formed on the substrate. The silicon nitride layer is UV-cured in an atmosphere lower than the standard atmospheric pressure. Through the UV curing treatment, the tensile stress of the silicon nitride layer is increased.

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