Semiconductor device manufacturing: process – Formation of electrically isolated lateral semiconductive... – Grooved and refilled with deposited dielectric material
Reexamination Certificate
2005-05-10
2005-05-10
Whitehead, Jr., Carl (Department: 2813)
Semiconductor device manufacturing: process
Formation of electrically isolated lateral semiconductive...
Grooved and refilled with deposited dielectric material
C438S438000
Reexamination Certificate
active
06890831
ABSTRACT:
A method of fabricating a semiconductor device capable of improving reliability of a gate insulator film is obtained. This method of fabricating a semiconductor device comprises a step of forming a gate insulator film on the main surface of a semiconductor layer by heat treatment, and the step of forming the gate insulator film includes a step of performing the heat treatment in an atmosphere containing oxidizing gas at a temperature exceeding the temperature causing viscous flow of the gate insulator film thereby forming the gate insulator film on the main surface of the semiconductor layer.
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Dan Toru
Izumi Makoto
Nakasato Mayumi
Oda Masahiro
Sasada Kazuhiro
Dolan Jennifer M.
Jr. Carl Whitehead
Sanyo Electric Co,. Ltd.
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