Method of fabricating semiconductor components

Details Method of fabricating semiconductor components Method of fabricating semiconductor components

1998-06-19

2000-06-06

Whitehead, Jr., Carl

Semiconductor device manufacturing: process

Chemical etching

Liquid phase etching

438 31, 438 32, 438707, 438708, 438712, 438714, H01L 21461

Patent

active

060718293

ABSTRACT:
A method of fabricating a semiconductor component, the method including at least one step of etching an upper layer formed on a substrate. In the method, prior to forming the upper layer, at least one set made up of marker layers separated by intermediate layers of predetermined thicknesses is caused to be grown, where the marker layers and adjacent intermediate layers have different refractive indices, and then during etching of the upper layer refractive index discontinuities are detected optically and etching is stopped when the sequence of the optically detected discontinuities corresponds to a reference sequence representative of the thicknesses of the intermediate layers.

REFERENCES:
patent: 4177094 (1979-12-01), Kroon
patent: 4367044 (1983-01-01), Booth, Jr. et al.
patent: 4660979 (1987-04-01), Muething
patent: 4839311 (1989-06-01), Riley et al.
patent: 4910583 (1990-03-01), Behr et al.
patent: 5395769 (1995-03-01), Arienzo et al.
patent: 5633193 (1997-05-01), Baillargeon et al.
patent: 5796768 (1998-08-01), Mersali et al.
patent: 5805755 (1998-09-01), Amersfoort et al.

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