Method of fabricating semiconductor chips separated by scribe li

Details Method of fabricating semiconductor chips separated by scribe li Method of fabricating semiconductor chips separated by scribe li

1996-04-22

1997-04-22

Trinh, Michael

Semiconductor device manufacturing: process

Including control responsive to sensed condition

Optical characteristic sensed

438462, 438941, 438637, H01L 21301

Patent

active

056228996

ABSTRACT:
A process has been developed in which photoresist thinning at the edges of silicon chips, resulting from photoresist flowing from semiconductor chips, exhibiting features with raised topographies, to flat scribe regions, has been reduced. The reduction in photoresist flowing has been accomplished by creating a chessboard pattern of raised insulator and metal features, in the scribe line region, thus reducing the differences in topography between the scribe line and chip regions. The areas between the raised mesas, in the scribe line regions, are used for laser or optical endpoint detection of RIE processes.

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patent: 5136354 (1992-08-01), Morita et al.
patent: 5234868 (1993-08-01), Cote
patent: 5290711 (1994-03-01), Yanagisawa
patent: 5462636 (1995-10-01), Chen et al.
patent: 5472895 (1995-12-01), Park

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