Method of fabricating robust nucleation/seed layers for...

Details Method of fabricating robust nucleation/seed layers for... Method of fabricating robust nucleation/seed layers for...

2006-05-02

2006-05-02

Baumeister, B. William (Department: 2891)

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

To form ohmic contact to semiconductive material

C438S680000

Reexamination Certificate

active

07037837

ABSTRACT:
A method for fabricating a seed layer. A seed layer (126) is deposited over a barrier layer (124) using a three-step process comprising a low AC bias power step, a high AC bias power step, and a lower/zero AC bias power step. The low AC bias power step provides low overhang. The high AC bias power step provides good sidewall coverage. The lower/zero AC bias step recovers areas exposed by re-sputtering during the high AC bias power step.

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