Etching a substrate: processes – Forming or treating thermal ink jet article
Reexamination Certificate
2008-03-11
2008-03-11
Tran, Binh X. (Department: 1792)
Etching a substrate: processes
Forming or treating thermal ink jet article
C216S037000, C216S058000, C216S079000
Reexamination Certificate
active
11546437
ABSTRACT:
A method of fabricating a printhead is provided in which sacrificial material is deposited on a drive circuitry substrate and etched to define first zones, thermally expandable material is deposited on the first zones and etched with the substrate to define second zones, conductive material is deposited on the second zones and etched to define heating circuitry and connections between the heating and drive circuitry, thermally expandable material is deposited to embed the heating circuitry in the thermally expandable materials and etched to define thermally expandable actuator arms and closure members, chamber material is deposited and etched to form nozzle chambers having inkjet ports and associated actuator arms and closure members, the sacrificial material is etched so that each actuator arm has ends connected between the substrate and the associated closure member, and the substrate is etched to form ink supply channels for supply of ink under pulsed pressure.
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Silverbrook Research Pty Ltd
Tran Binh X.
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