Radiation imagery chemistry: process – composition – or product th – Imaging affecting physical property of radiation sensitive... – Making electrical device
Patent
1997-08-15
1999-08-24
Duda, Kathleen
Radiation imagery chemistry: process, composition, or product th
Imaging affecting physical property of radiation sensitive...
Making electrical device
430395, 430396, G03F 720
Patent
active
059423757
ABSTRACT:
A method of fabricating a printed wiring board, including the steps of (a) applying a photoresist film to a surface of a printed wiring board and inner surfaces of holes formed with the printed wiring board throughout a thickness thereof, (b) exposing the photoresist film to a light through a mask film and further through a light scattering layer composed of glass beads, and (c) developing and etching the photoresist film to form through-holes throughout the printed wiring board. For instance, the light scattering layer is constituted of two transparent light-transmissive films and a glass bead layer sandwiched between the transparent light-transmissive films. The method enables the inner surfaces of the holes to be sufficiently exposed to a light such as ultraviolet ray, to thereby provide a printed wiring board having fine through-holes.
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patent: 5516456 (1996-05-01), Shinohara et al.
patent: 5669800 (1997-09-01), Ida et al.
JP 4-56189 patent abstract, Arai, Feb. 1992.
JP 409186429 patent abstract, Matsuyama et al, Jul. 1997.
Duda Kathleen
NEC Corporation
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