Method of fabricating polysilicon thin film and thin film...

Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – On insulating substrate or layer

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

Reexamination Certificate

active

07964456

ABSTRACT:
A method of fabricating a polysilicon thin film produces a polysilicon thin film which is used to make a thin film transistor. The method includes depositing a silicon film containing amorphous silicon on a substrate, and performing thermal treatment on the silicon film at a predetermined temperature in an H2O atmosphere. Accordingly, the crystallization temperature and thermal treatment time are decreased when the amorphous silicon is crystallized by a solid phase crystallization method, and this prevents the substrate from being bent due to application of a thermal treatment process for a long time and at a high temperature. As a result of the invention, a polysilicon thin film having superior crystallization properties is obtained. Use of the polysilicon thin film in a thin film transistor results in the reduction of defects in the thin film resistor.

REFERENCES:
patent: 6066516 (2000-05-01), Miyasaka
patent: 6881618 (2005-04-01), Yamamoto
patent: 2002/0058366 (2002-05-01), Miyasaki et al.
patent: 2002/0102820 (2002-08-01), Hamada et al.
patent: 63-304670 (1988-12-01), None
patent: 08-330598 (1996-12-01), None
patent: 09-186085 (1997-07-01), None
patent: 11-329972 (1999-11-01), None
patent: 2001-185486 (2001-07-01), None
Watakabe et al “Polycrysatlline Silicon Thin-Film Transistors Fabricated by Defect reduction Mehods” IEEE Transactions on Electronic Devices, vol. 49, No. 12Dec. 2002.
“Polycrystalline Silicone Thin-film Transistor Fabricated by Defect Reduction Methods”, to Watakabe, et al. IEEE Transaction on Electron Devices, vol. 49, No. 12, Dec. 2002.
Korean Office Action of the Korean Patent Application No. 2004-11146, issued on Feb. 22, 2006.
Office action from the Japanese Patent Office issued in Applicant's corresponding Japanese Patent Application No. 2004-340254 dated Mar. 24, 2009.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Method of fabricating polysilicon thin film and thin film... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method of fabricating polysilicon thin film and thin film..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of fabricating polysilicon thin film and thin film... will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-2644866

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.