Method of fabricating plastic transfer molded semiconductor sili

Fishing – trapping – and vermin destroying

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437211, 437214, 437217, 437219, H01L 2160

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055211240

ABSTRACT:
The method includes the steps of (i). preparing a substrate from a fiber glass reinforced plastic board, then processing the substrate with terminal mounting holes and pre-scared grooves, (ii) fastening lead wire terminals or lead frame terminals to the terminal mounting holes, (iii) fastening diode dice, metal diode disc contacts or small outline axial mounted diodes to the terminals, (iv) molding a plastic molded body on each individual element of the substrate over each set of terminals and diodes, and (v) cutting off the connecting ribs of the terminals, hot dip tinning the terminals, and then separating the substrate through the pre-scaled grooves into individual semiconductor silicone bridge rectifiers for final packing individually.

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patent: 5013948 (1991-05-01), Tumpey et al.
patent: 5218231 (1993-06-01), Kudo
patent: 5391919 (1995-02-01), Torti et al.

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