Method of fabricating multilayer printed circuit board structure

Details Method of fabricating multilayer printed circuit board structure Method of fabricating multilayer printed circuit board structure

1986-01-09

1987-08-25

Bashore, S. Leon

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

156253, 156901, 174 685, 361388, 361414, 427 96, 427 97, H05K 306, H05K 103

Patent

active

046891102

ABSTRACT:
A composite printed circuit board structure including multiple layers of graphite interleaved with layers of a dielectric material, such as a polytetrafluoroethylene (PTFE) and woven glass laminate. Some of the dielectric layers are copper clad, and at least some of the graphite layers are positioned in close proximity to the copper cladding layers, to provide good heat dissipation properties. The PTFE provides a desirably low dielectric constant and the graphite also provides good mechanical strength and a low or negative coefficient of thermal expansion, to permit matching of the coefficient with that of chip carriers used to mount components on the circuit board.

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