Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate
2007-01-09
2007-01-09
Le, Thao P. (Department: 2818)
Semiconductor device manufacturing: process
Coating with electrically or thermally conductive material
To form ohmic contact to semiconductive material
C257SE21120, C257S021000
Reexamination Certificate
active
11174750
ABSTRACT:
A method of fabricating a MOS transistor by millisecond annealing. A semiconductor substrate with a gate stack comprising a gate electrode overlying a gate dielectric layer on a top surface of a semiconductor substrate is provided. At least one implanting process is performed to form two doped regions on opposite sides of the gate electrode. Millisecond annealing activates dopants in the doped regions. The millisecond anneal includes rapid heating and rapid cooling within 1 to 50 milliseconds.
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Chen Sheng-Tsung
Chen Yi-Jung
Huang Chien-Chang
Lin Shian-Jyh
Shih Neng-Tai
Le Thao P.
Nanya Technology Corporation
Quintero Law Office
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