Radiation imagery chemistry: process – composition – or product th – Imaging affecting physical property of radiation sensitive... – Making electrical device
Patent
1992-05-08
1994-10-25
McCamish, Marion E.
Radiation imagery chemistry: process, composition, or product th
Imaging affecting physical property of radiation sensitive...
Making electrical device
430314, 430318, G03F 700
Patent
active
053588266
ABSTRACT:
A method for simultaneously manufacturing metallized carriers from wafer-shaped substrates is described, wherein such wafer-shaped substrates permit the use of standard IC fabrication apparatus and methods. As a result, very thin and finely dimensioned traces can be deposited. Thin-film manufacturing techniques are used to create the high-density traces on the surface of the chip carriers, thereby permitting direct connections from the IC to the periphery of the carrier without the need for vias. A lid hermetically seals and protects the package. The traces are comprised of a plurality of metals to facilitate bonding, each of the metals homogeneous for a portion of the trace. One metal portion of the trace is of a type compatible with an IC chip placed in the carrier. Another metal portion of the trace is of a type compatible with a trace on a printed circuit board. A metal barrier is interposed between the metals to prevent metal diffusion from one metal to an adjoining portion of another metal.
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Exhibit A is a brochure by Kyocera describing their advanced packaging technologies for high speed/high integration circuits.
Exhibit B is a brochure by Kyocera describing design guidelines.
Exhibit C is a brochure by Kyocera describing new packaging technologies.
Exhibit D is a brochure by Raychem describing their high-density interconnect packaging and product design.
August Melvin C.
Christie Diane M.
Nelson Stephen
Neumann Eugene F.
Steitz Richard R.
Cray Research Inc.
Duda Kathleen
Kluth Daniel J.
McCamish Marion E.
Raasch Kevin W.
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