Method of fabricating interconnect layers on an integrated circu

Details Method of fabricating interconnect layers on an integrated circu Method of fabricating interconnect layers on an integrated circu

1988-08-29

1991-12-03

Simmons, David A.

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

156649, 156653, 156657, 156662, 156656, 427 99, 427124, 437192, H01L 2100

Patent

active

050697498

ABSTRACT:
A process of forming an interconnection layer for an integrated circuit in which the conductor pattern is embedded in a layer of insulating material to form a conductor-insulator layer. The conductor-insulator layer is formed by selectively filling recesses in a layer of insulating material with conductive material. The filling of the recesses is accomplished in two steps: depositing an initial layer of conductive material by a process which selectively deposits the conductive material on a seed material located in the bottom of the recesses, then depositing the bulk of the conductive material by a process which selectively deposits conductive material on existing conductive material.

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