Method of fabricating ink jet printheads

Details Method of fabricating ink jet printheads Method of fabricating ink jet printheads

1989-02-02

1989-10-24

Powell, William A.

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

156644, 156645, 156647, 156657, 156662, 1566591, 346140R, H01L 21306, B44C 122, C03C 1500, C03C 2506

Patent

active

048759686

ABSTRACT:
An improved method of fabricating a thermal ink jet printhead of the type produced by the mating of an anisotropically etched silicon substrate containing ink flow directing recesses with a substrate having heating elements and addressing electrodes is disclosed. An etch resistant material on one surface of a (100) silicon substrate is patterned to form at least two sets of vias therein having predetermined sizes, shapes, and predetermined spacing therebetween. The predetermined spacing permits selected complete undercutting by an anisotropic etchant within a predetermined etching time period. The patterned silicon substrate is anisotropically etched for the predetermined time period to form at least two sets of separate recesses, each recess being separated from each other by a wall, the surfaces of the walls being {111} crystal planes of the silicon substrate, whereby certain predetermined separately etched recesses are selectively placed into communication with each other by the selective undercutting while the remainder of the undercut walls provide strengthening reinforcement to the printhead, so that larger printheads may be fabricated which are more robust without relinquishing resolution or reducing tolerances.

REFERENCES:
patent: RE32572 (1988-02-01), Hawkins et al.
patent: 4638337 (1987-01-01), Torpey et al.
patent: 4774530 (1988-09-01), Hawkins
patent: 4786357 (1988-11-01), Campanelli et al.

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