Radiation imagery chemistry: process – composition – or product th – Imaging affecting physical property of radiation sensitive... – Making electrical device
Patent
1994-09-01
1995-10-31
Duda, Kathleen
Radiation imagery chemistry: process, composition, or product th
Imaging affecting physical property of radiation sensitive...
Making electrical device
430396, 2504921, G03F 720
Patent
active
054628377
ABSTRACT:
A method of fabricating a printed circuit board includes the steps of forming a circuit pattern, applying solder resist, and exposing the solder resist. The circuit pattern including pads is formed on a substrate. The solder resist is applied on the substrate and the circuit pattern. The solder resist between the pads is exposed using a light source which emits scattered light and a mask film which is equipped with light transmission portions. The width of each light transmission portion is narrower than the distance between the pads. This method enables the formation of the solder resist in between fine pads in such a way that it does not cover an upper surface of the pad. The solder resist thus formed between the fine pads provides sufficient adhesion to the substrate.
REFERENCES:
patent: 5246813 (1993-09-01), Hoshinouchi
Duda Kathleen
NEC Corporation
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