Method of fabricating hetero-junction bipolar transistor (HBT)

Semiconductor device manufacturing: process – Forming bipolar transistor by formation or alteration of... – On insulating substrate or layer

Reexamination Certificate

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C257S021000, C257S197000, C257S199000, C257S200000, C257S201000, C438S318000

Reexamination Certificate

active

08039351

ABSTRACT:
A method of fabricating a hetero-junction bipolar transistor (HBT) is disclosed, where the HBT has a structure incorporating a hetero-junction bipolar structure disposed on a substrate including of silicon crystalline orientation <110>. The hetero-junction bipolar structure may include an emitter, a base and a collector. The substrate may include a shallow-trench-isolation (STI) region and a deep trench region on which the collector is disposed. The substrate may include of a region of silicon crystalline orientation <100> in addition to silicon crystalline orientation <110> to form a composite substrate by using hybrid orientation technology (HOT). The region of crystalline orientation <100> may be disposed on crystalline orientation <110>. Alternatively, the region of silicon crystalline orientation <110> may be disposed on crystalline orientation <100>.

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U.S. Appl. No. 11/969,448, filed Jan. 4, 2008, Office Action dated Sep. 16, 2009.

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