Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step
Patent
1993-03-25
1994-12-20
Breneman, R. Bruce
Adhesive bonding and miscellaneous chemical manufacture
Delaminating processes adapted for specified product
Delaminating in preparation for post processing recycling step
156662, 156656, B44C 122
Patent
active
053743288
ABSTRACT:
A solution of hydrogen peroxide [H.sub.2 O.sub.2 ], citric acid [HOC(CH.sub.2 COOH).sub.2 COOH.H.sub.2 O], and a salt of citric acid such as potassium citrate [HOC(CH.sub.2 COOK).sub.2 COOK.H.sub.2 O], and hydrogen peroxide [H.sub.2 O.sub.2 ], in a proper pH range, selectively etches GaAs-containing Group III-V compounds in the presence of other Group III-V compounds. As an illustration, Al.sub.y Ga.sub.1-y As is selectively etched in the presence of Al.sub.x Ga.sub.1-x As (0.ltoreq.y<0.2 & x>0.2) when the pH range of the etchant solution is between approximately 3 and 6. The etchant solution described herein may be utilized in the fabrication of, for example, high-frequency transistors exhibiting improved saturated current (I.sub.dss) and threshold voltage (V.sub.th) uniformity.
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DeSalvo, Tsens, Comas, "Etch rates and seletivities of citric acid/hydrogen peroxide on GaAs, AlGaAs, InGaAs (In.sub.0.2 Ga.sub.0.8 As), (In.sub.0.53 Ga.sub.0.47 As); (In.sub.0.52 Al.sub.0.48 As) and Indium Phosphid". J. Electrochem. Soc., 139(3), 831-5. 76-3. (Electric Phenomena.).
Brunemeier Paul E.
Remba Ronald D.
Rosenblatt Daniel H.
Schmukler Bruce C.
Strifler Walter A.
Breneman R. Bruce
Chang J. Y.
Watkins Johnson Company
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