Metal working – Method of mechanical manufacture – Electrical device making
Patent
1995-06-07
1997-02-25
Arbes, Carl J.
Metal working
Method of mechanical manufacture
Electrical device making
29830, 29840, H01R 4300
Patent
active
056049773
ABSTRACT:
A thermal detection system (10) includes a focal plane array (12), a thermal isolation structure (14), and an integrated circuit substrate (16). Focal plane array (12) includes thermal sensors (28), each having an associated thermal sensitive element (30). Thermal sensitive element (30) is coupled with one side to infrared absorber and common electrode assembly (36) and on the opposite side to an associated contact pad (20) disposed on the integrated circuit substrate (16). Reticulation kerfs (52a, 52b) separate adjacent thermal sensitive elements (30a, 30b, 30c) by a distance at least half the average width (44, 46) of a single thermal sensitive element (30a, 30b, 30c). A continuous, non-reticulated optical coating (38) may be disposed over thermal sensitive elements (30a, 30b, 30c) to maximize absorption of thermal radiation incident to focal plane array (12).
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Honeywell Sensor and System Development Center, R. A Wood et al., "HIDAD--A Monolithic, Silicon, Uncooled Infrared Imaging Focal Plan Array", pp. 579-581.
Belcher James F.
Beratan Howard R.
Frank Steven N.
Hanson Charles M.
Johnson Paul O.
Arbes Carl J.
Donaldson Richard L.
Kesterson James C.
Petersen Bret J.
Texas Instruments Incorporated
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