Method of fabricating electronic device having stacked chips

Details Method of fabricating electronic device having stacked chips Method of fabricating electronic device having stacked chips

2011-04-12

2011-04-12

Landau, Matthew C (Department: 2813)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

C438S015000, C438S021000, C438S051000

Reexamination Certificate

active

07923291

ABSTRACT:
A method of fabricating an electronic device having stacked chips is provided. The method includes forming a plurality of chips arranged in a row direction and at least one chip arranged in a column direction. A molding layer is formed between the chips. Grooves are formed in the molding layer between the chips arranged in the row direction. Conductive interconnections are formed on the substrate having the grooves. The substrate is sawn along an odd- or even-numbered one of the grooves to be separated into a plurality of unit substrates. At least one of the separated unit substrates is folded along an unsawn groove of the grooves.

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