Method of fabricating electronic circuit device

Details Method of fabricating electronic circuit device Method of fabricating electronic circuit device

1998-02-17

2000-08-08

Graybill, David E.

Semiconductor device manufacturing: process

Making device or circuit responsive to nonelectrical signal

Physical stress responsive

438115, 438119, 438126, H01L 2100, H01L 2144, H01L 2148, H01L 2150

Patent

active

061001082

ABSTRACT:
An electronic circuit device fabrication method securing a bond width of a seal portion when heat treatment is needed in sealing a device cavity by a cap. An electronic part mounting step is executed to secure electronic parts, including a semiconductor acceleration sensor chip, within a package main body by using a silicone group die bonding material and a silicone group silver paste. At a baking step, the package main body mounted with the electronic part is heated to a baking temperature of about 380.degree. C..+-.5.degree. C. In a sealing step, the package main body and the cap are bonded by a sealing material by executing a heat treatment in a state where the sealing material, comprising a low melting point glass, is interposed between a peripheral edge portion of the cavity in the package main body and the cap. The temperature of the package main body is then heated in the heat treatment to about 365.degree. C..+-.5.degree. C., which is lower than the baking temperature at the baking step.

REFERENCES:
patent: 4622433 (1986-11-01), Frampton
patent: 4963002 (1990-10-01), Tagusa et al.
patent: 5503016 (1996-04-01), Koen
patent: 5554569 (1996-09-01), Ganesan et al.
patent: 5554806 (1996-09-01), Mizuno et al.

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