Method of fabricating conductive lines

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material

Reexamination Certificate

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Details

C438S595000, C438S597000, C438S197000, C438S619000, C438S672000, C438S643000, C438S648000, C257SE21591, C257SE21166

Reexamination Certificate

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11236961

ABSTRACT:
A method of forming a conductive line suitable for decreasing a sheet resistance of the conductive lines. The method comprises steps of providing a material layer having a conductive layer formed thereon and forming a patterned mask layer on the conductive layer. In addition, a portion of the conductive layer is removed by using the patterned mask layer as a mask and a spacer is formed on a sidewall of the patterned mask layer and the conductive layer. A portion of the conductive layer is removed until the material layer is exposed to form a conductive line, wherein the spacer and the patterned mask layer serve as a mask.

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patent: 6831007 (2004-12-01), Kim
patent: 2003/0166335 (2003-09-01), Kim et al.
patent: 2004/0203231 (2004-10-01), Hsieh

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