Method of fabricating complex micro-circuit boards and substrate

Details Method of fabricating complex micro-circuit boards and substrate Method of fabricating complex micro-circuit boards and substrate

1982-09-17

1985-07-23

James, Andrew J.

357 80, 357 82, 357 68, H01L 2334, H01L 2312, H01L 2348

Patent

active

045311455

ABSTRACT:
A substrate and method of manufacture wherein a substrate is molded from particulate material wherein grooves on and through the body are formed during substrate molding and prior to sintering. The substrate includes all buss structure molded therein. Cooling of chips is provided by providing a heat sink in grooves formed within a substrate and beneath the chips.

REFERENCES:
patent: 3438127 (1969-04-01), Lehtonen
patent: 4056681 (1977-11-01), Cook, Jr.

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