Method of fabricating circuit elements on an insulating substrat

Details Method of fabricating circuit elements on an insulating substrat Method of fabricating circuit elements on an insulating substrat

1993-10-07

1997-06-17

Tsai, H. Jey

Fishing, trapping, and vermin destroying

437230, 437192, H01L 2144, H01L 2148

Patent

active

056396864

ABSTRACT:
A new design concept is presented and demonstrated for the fabrication of active and passive components in integrated circuit (IC) devices for microwave signal transmission. High circuit packing density is desirable but the current configurations of the conventional flat strip type conductors present physical limitations to achieving such an objective. The new conductor configuration not only overcomes such circuit packing problems of the conventional line design, but provides additional improvements in performance parameters, such as lower circuit resistance and lower parasitic interactions; an ability to fabricate circuits to design specifications and to improve reliability at low cost. The new concept has been applied to the fabrication of transmission lines, capacitors, inductors, air bridges and to formulating the fabrication steps for a FET. Polyimide film enables an improved fabrication step to be performed in the invention, and a new processing technique for polyimide material has also been demonstrated.

REFERENCES:
patent: 3674914 (1972-07-01), Barr
patent: 3713219 (1975-10-01), Lichtblau
patent: 4795722 (1989-01-01), Welch et al.
patent: 4857481 (1989-08-01), Tam et al.
patent: 5063169 (1991-11-01), De Bruin et al.
patent: 5094979 (1992-03-01), Kusano
patent: 5455187 (1995-10-01), Richards et al.
Japanese Abstract, vol. 12, No. 55 (M669) (2902) published Feb. 19, 1988.

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