Semiconductor device manufacturing: process – Semiconductor substrate dicing
Reexamination Certificate
2005-05-23
2009-06-09
Booth, Richard A. (Department: 2812)
Semiconductor device manufacturing: process
Semiconductor substrate dicing
C438S462000
Reexamination Certificate
active
07544586
ABSTRACT:
A method of fabricating a plurality of chips, with each chip including at least one circuit. This method includes the successive steps of creating chips on a layer of semiconductor material that is integral with a substrate; forming a weakening pattern corresponding to a predetermined cutting pattern on a support; transferring the chip-containing layer from the substrate to the support; and forming individual chips by cutting the chip-containing layer in accordance with the predetermined cutting pattern. Also, an assembly for fabricating a plurality of chips, each chip including at least one circuit provided on a layer of semiconductor material that is carried by a support that includes a weakening pattern corresponding to a predetermined cutting pattern for forming individual chips, with the support being obtained by assembling a plurality of individual tiles with boundaries between the individual tiles corresponding to the weakening pattern. The tiles may be assembled by disposing a binder between the individual tiles, with the binder ensuring temporary bonding of the tiles.
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Ghyselen Bruno
Rayssac Olivier
Booth Richard A.
S.O.I. Tec Silicon on Insulator Technologies
Winston & Strawn LLP
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