Method of fabricating bumps utilizing a resist layer having...

Details Method of fabricating bumps utilizing a resist layer having... Method of fabricating bumps utilizing a resist layer having...

2005-05-31

2005-05-31

Chambliss, Alonzo (Department: 2814)

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

To form ohmic contact to semiconductive material

C438S613000

Reexamination Certificate

active

06900117

ABSTRACT:
A bump forming method having a step of patterning a resist layer so as to have a penetrating hole above a pad, a step of applying energy to cause cross-linking in the resist layer, and hardening at least a surface of the resist layer, and a step of forming a metal layer electrically connected to the pad within the penetrating hole.

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