Method of fabricating array substrate

Details Method of fabricating array substrate Method of fabricating array substrate

2009-12-23

2011-11-22

Hoang, Quoc (Department: 2892)

Semiconductor device manufacturing: process

Making field effect device having pair of active regions...

On insulating substrate or layer

C257SE21372

Reexamination Certificate

active

08062936

ABSTRACT:
A method of fabricating an array substrate for a display device includes steps of forming a gate line and a gate electrode on a substrate, forming a gate insulating layer and an intrinsic amorphous silicon layer, forming an oxide semiconductor layer, increasing a conductive property of the oxide semiconductor layer, forming a metal layer, forming a first photoresist pattern and a second photoresist pattern having a thinner thickness than the first photoresist pattern, forming a data line, a source drain pattern, an oxide semiconductor pattern and an active layer, removing the second photoresist pattern and exposing the source drain pattern, wet-etching the source drain pattern using a first etchant, thereby forming source and drain electrodes, wet-etching the oxide semiconductor pattern using a second etchant, thereby forming ohmic contact layers, removing the first photoresist pattern, forming a passivation layer having a drain contact hole exposing the drain electrode on the source and drain electrodes, and forming a pixel electrode connected to the drain electrode through the drain contact hole, wherein the active layer has a uniform thickness in the switching region.

REFERENCES:
patent: 7666697 (2010-02-01), Yoon

Affiliated with

Also associated with

Rating

Method of fabricating array substrate does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method of fabricating array substrate, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of fabricating array substrate will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-4307391