Method of fabricating and integrated circuit through...

Details Method of fabricating and integrated circuit through... Method of fabricating and integrated circuit through...

2007-02-27

2007-02-27

Siek, Vuthe (Department: 2825)

Computer-aided design and analysis of circuits and semiconductor

Nanotechnology related integrated circuit design

C716S030000

Reexamination Certificate

active

10708256

ABSTRACT:
A method of fabricating an integrated circuit. The integrated circuit has a semiconductor body. The method includes forming a plurality of basic units with the same component characteristic on the semiconductor body, and forming at least a layout layer to program the basic units for building a clocked logic circuit and a non-clocked logic circuit without placing restrictions on positions of the clocked logic circuit and the non-clocked logic circuit on the semiconductor body.

REFERENCES:
patent: 6445065 (2002-09-01), Gheewala et al.
patent: 6902957 (2005-06-01), Wang et al.
patent: 2003/0140080 (2003-07-01), Friend et al.

Affiliated with

Also associated with

Rating

Method of fabricating and integrated circuit through... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method of fabricating and integrated circuit through..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of fabricating and integrated circuit through... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3823882