Metal working – Method of mechanical manufacture – Electrical device making
Patent
1994-03-07
1997-09-02
Arbes, Carl J.
Metal working
Method of mechanical manufacture
Electrical device making
174 522, 174 524, 438123, H01R 4300
Patent
active
056619006
ABSTRACT:
A method of fabricating a semiconductor device comprising the steps of providing an encapsulated semiconductor device bonded to a lead frame, providing a support ring formed of a material which softens when subjected to one of ultrasonic energy or formed of a material which softens when subjected to heat insufficient to cause sufficient expansion of said lead frame relative to said support ring to cause buckling of the leads of said lead frame, preferably thermoplastic and preferably polyphenylene sulfide, disposing leads of said lead frame over said support ring and causing said leads to embed in said support ring by applying ultrasonic energy to said support ring or by applying heat to said support ring insufficient to cause sufficient expansion of said lead frame relative to said support ring to cause buckling of the leads of said lead frame. The lead frame is preferably formed of gold plated copper, solder plate or tin plate.
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Chiu Anthony M.
Dennis William K.
Hundt Paul J.
McLellan Robert N.
Arbes Carl J.
Brady Wade James
Donaldson Richard L.
Hashim Paul C.
Texas Instruments Incorporated
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