Method of fabricating an electrostatic print head

Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step

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Details

156644, 156652, 156656, 1566591, 156901, 346155, C23F 102, B44C 122, G01D 1506

Patent

active

044154038

ABSTRACT:
An electrostatic print head and method of fabrication therefor in which a head is provided having a precision high resolution array of styli of intended cross-section and an interconnect pattern for simple connection to driving circuits. A planar thin film pattern of spaced metal electrode lines is provided by photolithographic and electroforming techniques on one surface of a glass or ceramic substrate, and a spaced array of planar thin film buss lines are similarly formed on the opposite surface. The electrode lines and buss lines are formed by vacuum deposition of a metal onto the substrate surfaces, etching into intended patterns, and electroforming to the required thickness and cross-sections. Electronic components can be provided in film form on the same substrate as the electrode lines.

REFERENCES:
patent: 3725950 (1973-04-01), Lamb
patent: 3903594 (1975-09-01), Koneval
patent: 3962002 (1976-06-01), Finkbeiner et al.
patent: 4287525 (1981-09-01), Tagawa

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