Method of fabricating an electronic device

Details Method of fabricating an electronic device Method of fabricating an electronic device

2007-02-20

2007-02-20

Wilczewski, M. (Department: 2822)

Semiconductor device manufacturing: process

Making field effect device having pair of active regions...

On insulating substrate or layer

C438S099000, C438S159000

Reexamination Certificate

active

11131387

ABSTRACT:
A method of fabricating an electronic device includes the following steps: a) providing a substrate; b) forming a first strip on the substrate; c) coating an insulation layer on the first strip and the substrate while completely overlaying the first strip and the substrate with the same; d) forming a second strip on the insulation layer; e) forming conductive polymer on the insulation layer while completely overlaying the second strip with the same; f) etching the conductive polymer via plasma etching for completely removing the conductive polymer on the second strip; and g) forming a semiconductor layer on the second strip and the conductive polymer.

REFERENCES:
patent: 6913944 (2005-07-01), Hirai
patent: 2004/0129937 (2004-07-01), Hirai
patent: 2004/0132285 (2004-07-01), Andideh et al.
patent: 2005/0029514 (2005-02-01), Moriya
patent: 2005/0156163 (2005-07-01), Hirai
patent: 2005/0194615 (2005-09-01), Huang et al.

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