Semiconductor device manufacturing: process – Making device array and selectively interconnecting – Using structure alterable to nonconductive state
Reexamination Certificate
2006-06-27
2006-06-27
Chambliss, Alonzo (Department: 2814)
Semiconductor device manufacturing: process
Making device array and selectively interconnecting
Using structure alterable to nonconductive state
C438S149000, C438S215000, C438S311000, C438S333000, C438S601000, C257S209000, C257S347000, C257S529000
Reexamination Certificate
active
07067359
ABSTRACT:
A method and apparatus for providing an electrical fuse is provided. An electrical fuse is patterned from the active layer of a semiconductor-on-insulator (SOI) wafer. One shape of the electrical fuse may be a first and second portion electrically coupled via a third section. The third section is typically thinner than the first and second portion. An ion implant is performed to fully deplete the electrical fuse, and a silicidation process is performed. Thereafter, standard processing techniques may be used to form vias and other integrated circuit structures.
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Slater & Matsil L.L.P.
Taiwan Semiconductor Manufacturing Company , Ltd.
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