Method of fabricating an air-filled waveguide on a semiconductor

Details Method of fabricating an air-filled waveguide on a semiconductor Method of fabricating an air-filled waveguide on a semiconductor

1996-06-14

1997-06-10

Quach, T. N.

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

To form ohmic contact to semiconductive material

438106, H01L 21283

Patent

active

056375212

ABSTRACT:
A method of using layers of gold metallization and a thick film coating of photo-sensitive material to form an air-filled microwave waveguide structure on the outer surface of a semiconductor body, such as a monolithic microwave integrated circuit commonly referred to as an MMIC, so that the waveguide can be coupled to the active and passive devices of the MMIC. First, a patterned metallization layer is formed on a substrate. A mold of a waveguide is fabricated by masking and then etching another metallization layer. The mold is turned over face down on the patterned metallization layer and bonded to the patterned metallization layer, Then, any unnecessary material is etched away.

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Wolf., S., et al., Silicon Processing, Lattice Press, 1986, vol. 1, pp. 4409, 427-446.

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