Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate
2005-09-13
2005-09-13
Chambliss, Alonzo (Department: 2814)
Semiconductor device manufacturing: process
Coating with electrically or thermally conductive material
To form ohmic contact to semiconductive material
C438S614000, C029S874000, C257S774000, C257S775000, C257S781000
Reexamination Certificate
active
06943100
ABSTRACT:
In a writing board wherein an opening is defined at a predetermined position of a film-like insulating substrate, an electric wiring provided with a connection terminal covering the opening is disposed on a principle plane of the insulating substrate, and a conductive member to be connected with the connection terminal of the electric wiring is disposed inside the opening; the conductive member having a thickness from a surface on which the electric wiring of the insulating substrate has been disposed is thinner than that of the insulating substrate.
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Masanori Mizoguchi et al., “Circuit Board”, Patent Abstracts of Japan, Pub. No. 09-017828, Jan. 17, 1997.
Chinda Akira
Matsuura Akira
Chambliss Alonzo
Hitachi Cable Ltd.
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