Method of fabricating a wire bond with multiple stitch bonds

Details Method of fabricating a wire bond with multiple stitch bonds Method of fabricating a wire bond with multiple stitch bonds

2007-05-08

2007-05-08

Chambliss, Alonzo (Department: 2814)

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

To form ohmic contact to semiconductive material

C257S784000, C228S180500

Reexamination Certificate

active

10798053

ABSTRACT:
The invention provides a wire bond bonding a wire to a connection pad of an electronic device, and a method of forming the wire bond. A first stitch bond is formed on the connection pad, and a second stitch bond is next formed on the connection pad that is contiguous with the first stitch bond.

REFERENCES:
patent: 4415115 (1983-11-01), James
patent: 6426563 (2002-07-01), Fujihira
patent: 6583483 (2003-06-01), Masumoto et al.
patent: 6602778 (2003-08-01), Manning et al.
patent: 6774494 (2004-08-01), Arakawa
patent: 6815836 (2004-11-01), Ano
patent: 7064433 (2006-06-01), Wong et al.
patent: 2003/0230796 (2003-12-01), Ismail et al.

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